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For All Intel Socket LGA775 CPU
HTC technology design.
Pillar Patent design.
Ultra silent 70x70x15mm PWM fan.
6mm x3 heat pipes design.
Easy installation.
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Model Name |
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DN75-73SHP-X3A |
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Dimensions(mm) |
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72(L) X 65(W) X 75.5(H) |
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Weight |
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300g |
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Bearing Type |
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N.D.B |
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Rated Voltage |
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12 VDC |
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Rate Current |
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0.18 AMP(MAX) |
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Air Flow |
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11~25 (CFM) |
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Noise Level |
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16~30 dBA |
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Speed (PWM) |
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500rpm~3600rpm |
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Life |
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60,000 hurs |
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Thermal Resistance |
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0.29 (C/W) |
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HTC technology (Heat-pipe Touch Chip)
We believe only heat pipe touch chip will make better thermal resistance, so we design a flat heat pipe surface to touch chip (like CPU cooler or other heat resource) to improve the heat sink efficiency. In our design, 6mm and 8mm heat pipe are mature manufacturing process for us. |
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PILLAR Technology
In pillar design, we increase the exchange surface of heat via the stamped fin. Pillar technology + HTC technology together improve performance of heat sink a lot. Heat will be conducted via aluminum pillar to fin, and we could increase the fin to enlarge thermal exchange surface area. |
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