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For All Intel Socket LGA775 CPU

Vapor chamber technology.
Ultra high performance.
Weight <500g.
Easy Installation.
Best choice for 1U/ blade server system.

	Model Name			SN75-P3AVS-01A
	Dimensions(mm)			95(L) X 95(W) X 38(H)
	Weight			490 g
	Material			All Copper

Heat conducts through the liquid saturated wick to a liquid-vapor interface located on top of the wick and from there it is removed via phase change. Evaporating menisci form on top of the wick at the evaporator of the VC and cause an increase in a capillary pressure. Also the evaporating menisci cause the vapor pressure to be higher at the evaporator than at the condenser. Due to a lower vapor pressure at the condenser, the vapor? flows from the evaporator to the condenser. The condensate is returned via capillary action back to the evaporator.

Wick structureGCu Powder High capillary pumping High heat flex density Work under any orientations, e.g, horizontal, gravity-aided and against gravity.

The wick serves as a pump, using capillary pressure to return the working fluid to the evaporator. The wick also acts to increase internal surface area to allow higher heat flux.